Scrona AG, a leading digital microfabrication startup known for deploying the world's first MEMS based electrohydrodynamic (EHD) multi-nozzle printheads, has announced a collaboration with Electroninks, the leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging. The companies will partner on process development, optimizing the use of Electroninks' materials within Scrona's MEMS based EHD printhead technology, to drive new use cases in the semiconductor industry.
As part of their partnership, Electroninks will make its advanced materials available to Scrona for processing with Scrona's EHD printhead technology. Scrona will then explore ways to incorporate Electroninks' materials into its existing product lines and applications and potentially new generations of its printheads. Joint research and development will take place in Scrona's Zürich application lab and in a regional technology center in Taiwan.
"This alliance between Scrona and Electroninks will accelerate innovation in semiconductor manufacturing by pushing the boundaries of what's possible in packaging in target applications such as RDL repair and fine line metalization, via filling and 3D interconnects," said Patrick Heissler, CEO of Scrona. "Our R&D efforts and process development can help meet the growing demand for higher performance, device miniaturization and reliability. "
"By working together, our companies can drive the commercialization of advanced semiconductor packaging processes that utilize cutting-edge EHD print head technology," said Melbs LeMieux, cofounder and president of Electroninks. "This will allow our customers to better adopt fine line print/repair, and RDL metallization solutions, thereby enabling the integration of complex functionalities into compact semiconductor packages."
